PCE promotes design possibilities
Today it is widely recognized that photochemical etching (PCE) is a precise and cost-effective method for manufacturing complex components with intricate geometries, tight tolerances, and highly reproducible results for large-scale production. Less well known, however, is how this technology continues to evolve – and what this evolution means for expanding design freedom.
micrometal GmbH is at the forefront of PCE development, supporting industry in realizing increasingly complex and intricate parts and components.
Jochen Kern, Head of Sales & Marketing at micrometal GmbH, says: “As a catalyst for design freedom, the precision and repeatability of PCE are a critical starting point. At micrometal, we have further refined an already precise process and developed it into the world’s most precise PCE process. Our etching process differs significantly from conventional PCE methods. We use a special liquid resist system to create ultra-thin photoresist layers that enable higher precision in the chemical etching process. This allows us to achieve extremely small structures and repeatable tolerances in the single-digit micrometer range. Conventional PCE methods use comparatively thick dry resists, which limit maximum component precision and achievable tolerances. In production, we also employ glass photomasks with a resolution of 100,000 dpi, which offer significantly better reproduction and resolution than film phototools used in conventional chemical etching processes.”
The use of digital tools is one of the key features of PCE that opens up new possibilities for design engineers. Since no costly tooling is required and tool lead times are short, design changes can be implemented easily. This flexibility enables designers to think outside the box and test new design concepts that would be too expensive or time-consuming with traditional manufacturing methods.
This agility is further enhanced by micrometal’s unique PCE process, which enables dimensional tolerances down to +/-0.005 mm, minimum feature sizes of 25 micrometers, a minimum hole diameter of 80% of material thickness, and repeatable tolerances in the single-digit micrometer range. In comparison, conventional chemical etching only achieves minimum feature sizes of approximately 100 micrometers, and the smallest hole diameter in relation to material thickness is at a factor of 1–2. It thus becomes clear how micrometal’s PCE process opens up numerous design possibilities that were previously impossible.
Kern continues: “With ultra-precise manufacturing, micrometal’s PCE process offers virtually unlimited geometric complexity. Unlike traditional manufacturing methods, higher complexity does not result in increased time or cost. This allows you to design and prototype multiple variants of an extremely complex component within just a few days. Furthermore, the process itself has unique characteristics – such as the etch cusp – that facilitate the implementation of otherwise difficult-to-realize product features such as sharp edges and tapered openings. By understanding the physical properties of the material to be etched and the process, designers can develop components that are not only functionally more efficient but – where appropriate – also aesthetically appealing. This is best achieved through close collaboration with a photochemical etching specialist who provides support in Design for PCE (DfPCE).”
PCE plays an important role in promoting design freedom. It offers numerous advantages over traditional manufacturing methods, including lower costs, higher precision and accuracy, shorter lead times, and the ability to realize complex shapes with minimal effort. When you choose micrometal’s PCE process for your next project, you unlock a world of possibilities that were previously unattainable with conventional technologies – and even with older PCE methods.
